UV adhesives made for electronic assembly fall under the categories of encapsulation, conformal coating, bonding, and sealing due to their excellent surface hardness and clarity when fully cured.
Being 100% solventless and with no Volatile Organic Compounds (VOC) in the formulation, it has gained wide acceptance by the electronic industry for use in encapsulation, bonding, and coating applications as these adhesives provide clarity, low shrinkage, good durometer, aging, and temperature resistance.
All these ranges of electronic grade UV adhesives from Parlite (Parson Adhesive Inc) & Everwide Chemical are the end products of the requirements being put forward by the design engineers and users from the electronic industry. The UV adhesives are some of the best formulations being developed and have trimmed down the time to market demand.
Key Features
- 1 component adhesive.
- 100% solventless.
- High transparency.
- Variable viscosity.
- Good electrical insulation.
- Cure on demand with the light source.
- Will not cause corrosion to metal substrates
- Stable shelf life between 0 to 25°C
Applications
- Potting & Encapsulation (Glob Top) of bare die.
- Sealing of FPC connectors.
- Bonding of thermal switches.
- Bonding of clear plastic housing to wearable devices.
- Coating of E-Rod I/C Chip.
- Clear coating of Printed Circuit Board.