Electronics potting and encapsulating compounds by using 2 Component Epoxies from our range of offerings are formulated for consistent material performance, with excellent dielectric properties, electrical insulation resistance, thermal conductivity, thermal shock resistance, mechanical strength, adhesion, hardness, cure speed, chemical resistance and UL approval.
Key Features
- Room temperature curable.
- Variable viscosity and setting time.
- Has good temperature resistance property.
- Able to withstand thermal cycling.
- Bond exceptionally well to most substrates.
- Has thermal conductivity property.
- Able to meet UL fire rating standard.
Applications
- Automotive Coils
- Sensors
- Switches & Transformers
- Submersible Pumps
- Motors & Stators
- Relays, Resistors & Capacitors
