What is Tesa60742?
Tesa60742 is a thermally conductive, non-substrate acrylic adhesive tape developed specifically for electronics requiring effective heat dissipation. With a thickness of just 10µm and high thermal conductivity (0.6 W/mK), it is ideal for applications like display module bonding, MLB bonding, and attachment of heat dissipation materials. The tape offers strong bonding, high insulation, and is easy to handle, making it suitable for compact electronic device assemblies.
Composition and Structure
- No carrier/substrate
- Acrylic adhesive with PET structure
- Total thickness: 10µm
- Color: white adhesive, overall transparent appearance
- Thermal conductivity: 0.6 W/mK (Z-direction)
- Breakdown voltage: 0.4 KV
- Surface wettability: 79%
- Initial adhesion to steel: 3.5 N/cm
Key Properties
- Ultra-thin profile for compact assembly needs
- Excellent thermal conductivity for efficient heat transfer
- High surface adhesion even on small bonding areas
- High insulation for electronic safety
- Transparent appearance, ideal for minimal visibility in designs
- Easy to handle in automated and manual assembly processes
Applications of Tesa60742
- Heat source component bonding in devices such as displays and motherboards (MLB)
- Bonding of heat-conductive materials such as graphite sheets
- Heat dissipation from MLB/FPC to heat sinks
- Smartphone, tablet, and laptop thermal management
- Precision electronics assembly requiring heat transfer and space-saving solutions
Features & Benefits of Tesa60742
- High-performance heat dissipation solution
- Maintains excellent adhesion while conducting heat
- Ultra-thin structure supports tight design tolerances
- Improves device reliability through effective thermal management
- Ensures clean bonding without bulky material interference
- Supports high-speed production and assembly efficiency
Comparison with Other Adhesive Tapes
- Thinner and more thermally conductive than traditional foam tapes
- Offers better insulation than standard thermally conductive pastes
- Easier application and handling than liquid adhesives
- Superior wetting and bonding compared to conventional thermal pads
Why Choose VST Malaysia?
At VST Malaysia, we deliver advanced adhesive solutions like Tesa60742 to meet the demanding thermal management needs of today’s electronic manufacturers. With a commitment to product quality, technical expertise, and responsive customer service, we ensure your bonding and heat dissipation challenges are solved efficiently and reliably.