What is Tesa58471?
Tesa58471 is a black non-substrate heat-reactive double-sided tape developed for high-precision bonding applications in electronics and manufacturing. With a total thickness of 30µm, it is engineered to activate under heat and pressure, forming high-strength bonds without initial tack at room temperature. The tape’s ultra-thin design and halogen-free formulation make it ideal for securing internal structural components, fixing decorative elements, and ensuring precise alignment in tight assemblies.
Composition and Structure
- Product type: Black non-substrate heat-reactive double-sided tape
- Thickness: 30µm
- Adhesive system: Nitrile rubber / Phenolic resin
- Color: Black
- Release liner: Glassine paper
- Halogen-free: Yes, RoHS compliant
- Width: Commonly available in 1240mm
- Length: Commonly available in 50m
- Adhesion strength: 7 N/mm²
- Initial adhesion: No tack at room temperature; requires heat and pressure to bond
Key Properties
- Heat-activated bonding for secure, long-lasting adhesion
- 30µm thin profile suitable for miniaturized components
- Excellent bonding performance with both metals and plastics
- High strength with clean, invisible joints
- Halogen-free and environmentally compliant
- Reliable thermal performance under elevated temperatures
Applications of Tesa58471
- Internal structural bonding in electronic equipment: Fixes circuit boards, chips, and modules securely
- Key attachment in electronic devices: Ensures proper key positioning and tactile feedback
- Camera window and housing assembly: Forms tight seals to protect sensitive components
- Metal-to-plastic or metal-to-metal bonding: Ideal for bonding stainless steel, aluminum, PMMA, ABS, and PC
- Decorative elements: Attaches nameplates, logos, and trim securely to enhance product appearance
Features & Benefits of Tesa58471
- Heat-reactive adhesive enables precise alignment before bonding
- Ultra-thin construction minimizes impact on product dimensions
- Excellent shear strength and durability
- Suitable for automated and manual assembly processes
- Maintains stability under short-term and long-term thermal exposure
Comparison with Other Adhesive Tapes
- Thinner and more accurate than pressure-sensitive foam or film tapes
- Superior repositioning ability before bonding compared to traditional adhesives
- Better suited for miniaturized or heat-sensitive electronics
- Enhanced bonding strength without adding bulk to assemblies
Why Choose VST Malaysia?
VST Malaysia provides trusted access to high-performance bonding solutions like Tesa58471. We offer expert advice, fast service, and verified original products to help your business meet its production and quality goals. Let us support your next innovation with dependable adhesive solutions.