One Component Epoxy (1 Part) with semi-viscous flow has been used for potting and encapsulation of sensitive or electronics components from the harsh environment and electrical insulation purposes. It is much simpler to use as compared to a Two-Component Epoxy system since it is has been premixed and frozen to sustain its shelf life.
Like Two Component Epoxy, it possesses all the physical characteristics like viscosity, hardness, glass transition temperature, variable temperature resistance, good electrical properties, and shelf-life stability (if stored in the right condition).
Key Features
- Single component system. No mixing required.
- Heat curable for faster reactivity and cure profile.
- Ease of dispensing and application.
- Has good electrical insulation properties.
- Generally has higher Glass Transition (TG) Temperature.
- Good Thermal Coefficient of Expansion (CTE).
- Good cured hardness.
Applications
- Potting of RFID tags.
- Micromotors housing sealing.
- Relay sealing.
- Electronics potentiometer sealing.
- Smart card sealing.
