Low-Pressure Molding (LPM) compounds are made up of Polyamide and Polyolefin (hot-melt) materials or thermoplastic-based in the formulation. It is a process used to encapsulate and environmentally protect electronic components and PCBs. The purpose is to protect electronics against moisture, dust dirt and vibration.
These LPM compounds will melt flow at the required temperature and it is being injected into a metal mold with low-pressure force to encapsulate the bare components inside the metal cavity. Upon cooling, the component is being released from the metal mold that is completed encapsulated with the LPM compounds.
These ‘hot melts’ are primarily used for the rapid assembly of structures that are subject to light loads, such as the filter industry, electronics and sensitive components.
