Snap-Curing series with 100% solid for ultimate productivity
Wire-bonding capable to 250°C for faster throughput applications
Usage temperatures from standard Mil-Std and automotive electronics to >250°C specialty applications
Large area low-stress series
Choices of viscosities for screening-stenciling or pin-transfer
Choices of electrical and/or thermal performance based on silver, gold, diamond, alumina, aluminum and boron nitride, and other specialty metals and derivatives
Tg=240°C and -55°C and combinations for specialty applications
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We provide tailored solutions in die-cut, tapes, adhesives, and automation machine to enhance your manufacturing processes. Partner with us to discover how our innovative products can drive efficiency and success for your business.
