Like Epoxy & Polyurethane potting compounds, Silicone encapsulation offers robust protection to the sensitive electronic components and devices from the harsh environment and offers electrical insulation purposes.
Silicone encapsulation compounds are available in 1 or 2 component systems that will cure to its full hardness when completely polymerised either with moisture or through curing agent or catalyst if it is 2 components.
With its wide range operating temperature conditions (-400C to 2000C), high flexibility, low Glass Transition property, makes it an ideal low-stress potting compound. Cured silicone potting compound has good electrical insulation, thermal conductivity, low dielectric constant for radio frequency application and low durometer hardness to absorb any form of stress or shock during operation. It can adhere very well to most engineering plastics.
